View MSM64172_293098.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

E2E0032-38-95 Semiconductor
Semiconductor MSM64172
This version: MSM64172 Sep. 1998 Previous version: Mar. 1996
4-Bit Microcontroller with Built-in Serial Port and LCD Driver
GENERAL DESCRIPTION
The MSM64172 is a low-power 4-bit microcontroller that incorporates Oki's original CPU core nX-4/20. The MSM64172 has a minimum instruction execution time of 5 ms (@ 600 kHz and 3.0 V). The device includes an internal 2016-byte program memory, 128-nibble data memory, two 4-bit input-output ports, 4-bit input port, 8-bit synchronous serial port, LCD driver for up to 92 segments, and buzzer output port. Applications include low-power products with LCD functions.
FEATURES
* Operating range Operating frequencies 1.5 V spec. 3.0 V spec. low-speed clock 3.0 V spec. high-speed clock Operating voltage Operating temperature * Memory space Internal program memory Internal data memory * Minimum instruction execution time * Serial port * LCD driver (1) At 1/4 duty and 1/3 bias (2) At 1/3 duty and 1/3 bias (3) At 1/2 duty and 1/2 bias * Buzzer driver * Watchdog timer * Clock
: : : : : : : : : : : : : : :
32.768 kHz (crystal oscillation) 32.768 kHz (crystal oscillation) 600 kHz maximum (RC oscillation/ceramic resonator oscillation) 0.9 to 1.8 V (1.5 V spec.) 1.8 to 3.6 V (3.0 V spec.) -10 to +65C 2016 bytes 128 nibbles 5 ms @ 600 kHz (3.0 V spec. only) 91.6 ms @ 32.768 kHz Clock synchro, 8-bit data transfer 27 outputs (duty ratio switchable by software) 92 segments (max.) 72 segments (max.) 50 segments (max.) 1 output; ON/OFF controllable in four modes 32.768 kHz crystal oscillator RC oscillator/ceramic oscillator (600 kHz max.) for high-speed clock (only for 3.0 V spec.) 32.768 kHz Switchable to high-speed clock by software (only for 3.0 V spec.) 32.768 kHz 1.5 V/3.0 V (selectable by mask option), low power consumption
CPU clock
:
Time base clock * Power supply voltage
: :
1/29
Semiconductor * I/O port Input-output port Input port
MSM64172
: :
2 ports 4 bits 1 port 4 bits (16 out of the 27 LCD driver outputs can be used as output-only ports by a mask option.) 2 sources 5 sources : (Product name : MSM64172-GS-K) : (Product name : MSM64172-GS-2K) : (Product name : MSM64172-) indicates a code number.
* Interrupt sources External interrupt : Internal interrupt : * Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) Chip
2/29
BLOCK DIAGRAM
Semiconductor
BIAS
TR2
TR0
(4)
TR1 PCM PCL PCH A11 to A8 A7 to A0
ROM 2016B
VSS1 VSS2 VSS3 C1 C2 S0 S1
OSC2 OSC1 XT XT RESET TST1 TST2 VSSL
BSR HALT MIEF
2CLK RSTG TST VR C
PORT ADDRESS
ALU
LCD
B
A
H
L
X
Y
RAM 128N
S22 COM3/S23 COM2/S24 COM1 COM0 VSS
TIMING CONTROLLER
TBC 3 INT
WDT INT
(4)
(4)
DB7 to DB0
(8) P1 P2 INT INT P1.0 P1.1 P2.3 VSS P0 P0.0 P0.1 P0.2 P0.3
SP
ROMR
SIOP
IR DECODER
(8)
INT
IR
PORT ADDRESS DB7 to DB0 VSS INTC BD
VDD
MSM64172
3/29
is the CPU core (nX-4/20).
BD
Semiconductor
MSM64172
PIN CONFIGURATION (TOP VIEW)
S11/P5.3 S12/P6.0 S13/P6.1 S14/P6.2 S15/P6.3 S16 S17 (VDD) S18 S19 S20 S21 S22 COM3/S23 56 55 54 53 52 51 50 49 48 47 46 45 44 43
S10/P5.2 S9/P5.1 S8/P5.0 S7/P4.3 S6/P4.2 S5/P4.1 S4/P4.0 S3/P3.3 S2/P3.2 S1/P3.1 S0/P3.0 P1.0 P1.1 P1.2
1 2 3 4 5 6 7 8 9 10 11 12 13 14
42 41 40 39 38 37 36 35 34 33 32 31 30 29
COM2/S24 COM1 COM0 C2 C1 VSS3 VSS2 VSS1 VSSL OSC1 OSC2 XT XT RESET
Note: Pin 49 is internally connected to VDD, and VDD should be supplied from pin 21.
P1.3 P2.0 P2.1 P2.2 P2.3 VSS VDD P0.0 P0.1 P0.2 P0.3 BD TST1 TST2
15 16 17 18 19 20 21 22 23 24 25 26 27 28
56-Pin Plastic QFP
4/29
Semiconductor
MSM64172
PIN DESCRIPTIONS
Basic Functions
Function Symbol VDD VSS1 VSS2 Power Supply VSS3 VSS VSSL C1, C2 XT XT Oscillation OSC1 OSC2 P0.0 to P0.3 P1.0 to P2.3 BD S16 to S22 Ports S0/P3.0 to S15/P6.3 COM3/S23 COM2/S24 COM1 COM0 Reset Test RESET TST1 TST2 Type -- -- -- -- -- -- -- I O I O I I/O O O O O O O O I I I Description 0 V power supply Bias output for driving LCD (-1.5 V), or negative power supply at 1.5 V spec. Bias output for driving LCD (-3.0 V), or negative power supply at 3.0 V spec. Bias output for driving LCD (-4.5 V). Negative power supply for I/O port interface
Negative power supply for internal logic (internally generated constant voltage)
Pins for connecting a capacitor for generating VSS1, VSS2, and VSS3. 32.768 kHz crystal connection pins High-speed clock pins : A ceramic resonator and capacitors, or an external oscillation resistor (ROS), should be connected to these pins. Input port Input-output ports Buzzer driver pin LCD driver pins LCD driver pins or output ports by mask option LCD common 3 signal output pin, or segment signal output pin during 1/3 or 1/2 duty LCD common 2 signal output pin, or segment signal output pin during 1/2 duty LCD common 1 signal output pin LCD common 0 signal output pin Reset pin Input pins for testing
Secondary Functions
Symbol P1.3 P2.0 P2.1 P2.2 P2.3 Type I O O I/O O Serial data input pin (SIN) Serial data output pin (SOUT) Serial communication ready signal output pin (SPR) Serial communication clock input-output pin (SCLK) High-speed oscillation clock monitor pin for system clock (MON) Description
5/29
Semiconductor
MSM64172
MEMORY MAPS

Test program area 07FFH 07E0H 32 bytes 2016 bytes 03EH Interrupt area 020H Call zero page (CZP) area 010H 000H Start address 8 bits
Program Memory
Contents of Interrupt Area 03BH 038H 035H 032H 029H 026H 023H Watchdog timer interrupt External interrupt (0) Serial port interrupt External interrupt (1) 32 Hz interrupt 16 Hz interrupt 1 Hz interrupt
Program Memory Map Address 000H is the instruction execution start address after a system reset. The call zero page (CZP) area from address 010H to address 01FH assigns the start address for the CZP subroutine of one-byte call instruction. The start address of an interrupt subroutine is assigned to the interrupt address from address 02DH to 03DH. The user area has 2016 bytes at addresses 000H to 07DFH. No program can be stored in the test program area.
6/29
Semiconductor
MSM64172
Data Memory The data memory area consists of 8 banks and each bank has 256 nibbles (256 4 bits). The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0.
7FFH 780H 77FH 700H
BANK 7 Data RAM area Unused area
Data/Stack area (128 nibbles)
Contents of 000H to 07FH Inaccessible area 07FH
SFR area
0FFH 080H 07FH 000H
Unused area BANK 0 000H 4 bits
Data Memory Map The data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call Instruction and 8 nibbles are used by an interrupt. The addresses 080H to 0FFH of BANK 0 and the addresses 700H to 77FH of BANK 7 are not assigned as the data memory, so access to these addresses has no effect. Moreover, it is impossible to access BANK 1 to BANK 6.
7/29
Semiconductor
MSM64172
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
(VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Power Supply Voltage 5 Input Voltage 1 Input Voltage 2 Input Voltage 3 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Output Voltage 5 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VSS VIN1 VIN2 VIN3 VOUT1 VOUT2 VOUT3 VOUT4 VOUT5 TSTG Condition Ta = 25C Ta = 25C Ta = 25C Ta = 25C Ta = 25C VSS1 Input, Ta = 25C VSS Input, Ta = 25C VSSL Input, Ta = 25C VSS1 Output, Ta = 25C VSS2 Output, Ta = 25C VSS3 Output, Ta = 25C VSS Output, Ta = 25C VSSL Output, Ta = 25C -- Rating -2.0 to +0.3 -4.0 to +0.3 -5.5 to +0.3 -2.0 to +0.3 -5.5 to +0.3 VSS1 - 0.3 to +0.3 VSS - 0.3 to +0.3 VSSL - 0.3 to +0.3 VSS1 - 0.3 to +0.3 VSS2 - 0.3 to +0.3 VSS3 - 0.3 to +0.3 VSS - 0.3 to +0.3 VSSL - 0.3 to +0.3 -55 to +150 Unit V V V V V V V V V V V V V C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
(VDD = 0 V) Parameter Operating Temperature Operating Voltage Crystal Oscillation Frequency Symbol Top VSS1 VSS fXT Condition -- -- -- -- Range -10 to +65 -1.8 to -0.9 -5.25 to VSS1 30 to 35 Unit C V V kHz
8/29
Semiconductor
MSM64172
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VDD = 0 V, VSS1 = VSS = -1.5 V, Ta = -10 to +65C unless otherwise specified) Parameter
Symbol
Condition +100% -10% +100% -10%
Min.
Typ.
Max.
Unit
Measuring Circuit
VSS2 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance POR Generation Voltage POR Non-generation Voltage Supply Current 1 Supply Current 2
VSS2 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD VPOR1 VPOR2 IDD1 IDD2
Ca, Cb, C12 = 0.2 mF Ca, Cb, C12 = 0.2 mF -- Oscillation start time: within 5 seconds -- -- -- When external CG used --
-3.2 -4.7 -1.9 -- -- 0.1 12 12 12 -0.4 -1.5 -- -- -- -- -- --
-3.0 -4.5 -1.3 -- -- -- 15 -- 15 -- -- 3 3 8 8 10 10
-2.7 -4.1 -0.6 -0.9 -0.9 1000 20 30 20 0 -1.2 5 20 15 25 25 40
V V V V V ms pF pF pF V V mA mA mA mA mA mA
1
When VSS1 is between VPOR1 and -1.5 V No POR when VSS1 is between VPOR2 and -1.5 V CPU in halt state
Ta = -10 to +30C Ta = +30 to +65C
CPU in operating Ta = -10 to +30C state Serial transfer, fSCK = 300 kHz, CPU in operating state
Ta = +30 to +65C Ta = -10 to +30C
Supply Current 3
IDD3
Ta = +30 to +65C
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
9/29
Semiconductor DC Characteristics (continued)
MSM64172
(VDD = 0 V, VSS1 = VSSL = VSS = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -10 to +65C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VOH1 = -0.5 V VOL1 = VSS + 0.5 V VSS = -5 V, VOH1S = -0.5 V VSS = -5 V, VOL1 = VSS + 0.5 V VOH2 = -0.7 V VOL2 = VSS1 + 0.7 V VOH3 = -0.5 V VOL3 = VSS + 0.5 V VSS = -5 V, VOH3S = -0.5 V VSS = -5 V, VOL3S = VSS + 0.5 V VOH4 = -0.2 V (VDD level)
Min. -2.1 0.2 -9.0 1.0 -1.8 0.2 -1.5 0.1 -2.0 0.2 -- 4.0 -- 4.0 -- 4.0 -- -0.3
Typ. -0.7 0.7 -3.0 3.0 -0.6 0.6 -0.5 0.5 -0.7 0.7 -- -- -- -- -- -- -- --
Max. -0.2 2.1 -1.0 9.0 -0.2 1.8 -0.1 1.5 -0.2 2.0 -4.0 -- -4.0 -- -4.0 -- 0.3 --
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
Output Current 1 (P1.0 to P1.3) (P2.0 to P2.3)
IOH1 IOL1 IOH1S IOL1S IOH2 IOL2 IOH3 IOL3 IOH3S IOL3S IOH4 IOMH4
Output Current 2 (BD) Output Current 3 (When S0 to S15 are configured as output ports) (P3.0 to P3.3) (P4.0 to P4.3) (P5.0 to P5.3) (P6.0 to P6.3)
2
VOMH4 = VSS1 + 0.2 V (VSS1 level) VOMH4S = VSS1 - 0.2 V (VSS1 level) VOML4 = VSS2 + 0.2 V (VSS2 level) VOML4S = VSS2 - 0.2 V (VSS2 level) VOL4 = VSS3 + 0.2 V VOH = VDD VOL = VSS (VSS3 level)
Output Current 4 (S0 to S22) (COM0 to COM3)
IOMH4S IOML4 IOML4S IOL4
Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3)
IOOH IOOL
10/29
Semiconductor DC Characteristics (continued)
MSM64172
(VDD = 0 V, VSS1 = VSSL = VSS = -1.5 V, VSS2 = -3.0 V, VSS3 = -4.5 V, Ta = -10 to +65C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS (when pulled up)
VIH1 = VDD, VSS = -5 V (when pulled down)
Min. 5.0 -60 70
Typ. 18 -18 250 -250 -- -- -- -22 -- -0.75 -- -- -- -- -- -- 0.1 1.0
Max. 60 -5.0 660 -70 1.0 0 1.0 -6.0 1.0 -0.3 0 -1.2 0 -4.0 0 -1.2 0.3 1.5
Unit mA mA mA mA mA mA mA mA mA mA V V V V V V V V
Measuring Circuit
IIH1 Input Current 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) IIL1 IIH1S IIL1S IIH1Z IIL1Z Input Current 2 (OSC1) Input Current 3 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) IIH2 IIL2 IIH3 IIL3 VIH1 VIL1 VIH1S VIL1S Input Voltage 2 (RESET, TST1, TST2) Hysteresis Width (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) VIH2 VIL2 DVT1 DVT1S DVT2
VIL1 = VSS = -5 V (when pulled up) -660 VIH1 = VDD (in a high impedance state) VIL1 = VSS (in a high impedance state) VIH2 = VDD VIL2 = VSS1 VIH3 = VDD VIL3 = VSS1 -- -- VSS = -5 V VSS = -5 V -- -- -- VSS = -5 V -- 0 -1.0 0 -60 0 -1.5 -0.3 -1.5 -1.0 -5.0 -0.3 -1.5 0.05 0.25
3
4
0.05
0.1
0.3
V
CIN
--
--
--
5.0
pF
1
11/29
Semiconductor Measuring circuit 1
MSM64172
XT
MSM64172 (1.5 V Spec.)
VSSL VDD VSS1 A Cl V VSS2 VSS3 VSS
Crystal V 32.768 kHz DD XT C1 C2 CG C12 Note : Connect a 15 pF capacitor if CG is external.
Ca V
Cb V Ca, Cb, C12 Cl : 0.2 mF : 0.1 mF
Measuring circuit 2
(*2) VIH (*1) VIL
INPUT
VDD
VSS1
VSS2
VSS3
VSSL
VSS
OUTPUT
MSM64172 (1.5 V Spec.)
A
12/29
Semiconductor Measuring circuit 3
(*3) A
INPUT
MSM64172
MSM64172 (1.5 V Spec.)
VDD
VSS1
VSS2
VSS3
VSSL
VSS
Measuring circuit 4
VIH (*3) VIL
VDD
VSS1
VSS2
VSS3
VSSL
VSS
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
OUTPUT
INPUT
MSM64172 (1.5 V Spec.)
OUTPUT
Waveform Monitoring
13/29
Semiconductor AC Characteristics (Serial Interface)
MSM64172
(VDD = 0 V, VSS1 = -1.5 V, VSS = -5 V, Ta = -10 to +65C unless otherwise specified) Parameter SCLK Input Fall Time SCLK Input Rise Time SCLK Input "L" Level Pulse Width SCLK Input "H" Level Pulse Width SCLK Input Cycle Time SCLK Output Cycle Time SOUT Output Delay Time SIN Input Setup Time SIN Input Hold TIme Symbol tf tr tCWL tCWH tCYC tDDR tDS tDH Condition -- -- -- -- VSS = -5.25 V to VSS1 Cl = 10 pF -- -- Min. -- -- 0.8 0.8 1.8 -- -- 0.5 0.8 Typ. Max. -- -- -- -- -- 30.5 -- -- -- 1.0 1.0 -- -- -- -- 0.4 -- -- Unit ms ms ms ms ms ms ms ms ms
tCYC1(O) CPU operating at 32.768 kHz
AC characteristics timing ("H" level = 0.2 * VSS, "L" level = 0.8 * VSS)
tCYC SCLK (P2.2) tr tCWH tDDR SOUT (P2.0) tDDR 0V tf tCWL 0V
tDS SIN (P1.3)
tDH
tDS 0V
14/29
Semiconductor
MSM64172
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
(VDD = 0 V) Parameter Power Supply Voltage 1 Power Supply Voltage 2 Power Supply Voltage 3 Power Supply Voltage 4 Power Supply Voltage 5 Input Voltage 1 Input Voltage 2 Input Voltage 3 Output Voltage 1 Output Voltage 2 Output Voltage 3 Output Voltage 4 Storage Temperature Symbol VSS1 VSS2 VSS3 VSSL VSS VIN1 VIN2 VIN3 VOUT1 VOUT2 VOUT3 VOUT4 TSTG Condition Ta = 25C Ta = 25C Ta = 25C Ta = 25C Ta = 25C VSS2 Input, Ta = 25C VSS Input, Ta = 25C VSSL Input, Ta = 25C VSS2 Output, Ta = 25C VSS3 Output, Ta = 25C VSS Output, Ta = 25C VSSL Output, Ta = 25C -- Rating -2.0 to +0.3 -4.0 to +0.3 -5.5 to +0.3 -4.0 to +0.3 -5.5 to +0.3 VSS2 - 0.3 to +0.3 VSS - 0.3 to +0.3 VSSL - 0.3 to +0.3 VSS2 - 0.3 to +0.3 VSS3 - 0.3 to +0.3 VSS - 0.3 to +0.3 VSSL - 0.3 to +0.3 -55 to +150 Unit V V V V V V V V V V V V C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
(VDD = 0 V) Parameter Operating Temperature Operating Voltage External RC Oscillator Resistance Crystal Oscillation Frequency Ceramic Resonator Oscillation Frequency Symbol Top VSS2 VSS ROS fXT fCM Condition -- -- -- -- -- VSS2 = -3.6 V to -2.2 V Range -10 to +65 -3.6 to -1.8 -5.25 to -1.8 90 to 500 30 to 66 200 to 600 Unit C V V kW kHz kHz
15/29
Semiconductor
MSM64172
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
(VDD = 0 V, VSS2 = VSS = -3.0 V, Ta = -10 to +65C unless otherwise specified) Condition +100% -50% +100% -50% Min. Typ. Max. Unit
Measuring Circuit
Parameter
Symbol
VSS1 Voltage VSS3 Voltage VSSL Voltage Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal RC Oscillator Capacitance RC Oscillation Frequency POR Generation Voltage POR Non-generation Voltage
VSS1 VSS3 VSSL VSTA VHOLD TSTOP CG CGEX CD COS fOSC VPOR1 VPOR2
Ca, Cb, C12 = 0.1 mF Ca, Cb, C12 = 0.1 mF -- Oscillation start time: within 5 seconds -- -- -- When external CG used -- --
-1.7 -4.7 -1.9 -- -- 0.1 12 12 12 8.0 280 -0.7 -3.0
-1.5 -4.5 -1.3 -- -- -- 15 -- 15 12 560 -- --
-1.3 -4.3 -0.6 -1.8 -1.8 1000 20 30 20 16 800 0 -2.0
V V V V V ms pF pF pF pF kHz V V
1
External resistor ROS = 100 kW VSS2 = -1.8 to -3.6 V When VSS2 is between VPOR1 and -3.0 V No POR when VSS2 is between VPOR2 and -3.0 V
Notes: 1. "POR" denotes Power On Reset. 2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the system reset occurs.
16/29
Semiconductor DC Characteristics (continued)
MSM64172
(VDD = 0 V, VSS2 = VSS = -3.0 V, Ta = -10 to +65C unless otherwise specified) Parameter
Symbol
Condition CPU in halt state
Min.
Typ.
Max.
Unit
Measuring Circuit
Ta = -10 to +30C
-- -- -- -- -- --
1.5 1.5 5.0 5.0 220 170
3 15 13 25 500 400
mA mA mA mA mA mA
1
Supply Current 1
IDD1
(High-speed clock oscillation stop) Ta = +30 to +65C CPU in operating state (High-speed clock oscillation stop)
Ta = -10 to +30C
Supply Current 2
IDD2
Ta = +30 to +65C
Supply Current 3 Supply Current 4
IDD3 IDD4
CPU operating at 400 kHz (RC oscillation) CPU operating at 500 kHz (ceramic oscillation) Serial transfer, fSCK = 300 kHz,
Ta = -10 to +30C
--
7.0
25
mA
Supply Current 5
IDD5
CPU in operating state (High-speed clock Ta = +30 to +65C oscillation stop) -- 7.0 40 mA
17/29
Semiconductor DC Characteristics (continued)
MSM64172
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = VSS = -3.0 V, VSS3 = -4.5 V, Ta = -10 to +65C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VOH1 = -0.5 V VOL1 = VSS + 0.5 V VSS = -5 V, VOH1S = -0.5 V VSS = -5 V, VOL1 = VSS + 0.5 V VOH2 = -0.7 V VOL2 = VSS2 + 0.7 V VOH3 = -0.5 V VOL3 = VSS + 0.5 V VSS = -5 V, VOH3S = -0.5 V VSS = -5 V, VOL3S = VSS + 0.5 V VOH4 = -0.2 V (VDD level)
Min. -6.0 0.7 -9.0 1.0 -6.0 0.7 -1.5 0.15 -2.0 0.2 -- 4.0 -- 4.0 -- 4.0
Typ. -2.0 2.0 -3.0 3.0 -2.0 2.0 -0.6 0.6 -0.7 0.7 -- -- -- -- -- -- -2.0 2.0 -35 35 -- --
Max. -0.7 6.0 -1.0 9.0 -0.7 6.0 -0.15 1.5 -0.2 2.0 -4.0 -- -4.0 -- -4.0 -- -0.7 6.0 -10 100 0.3 --
Unit mA mA mA mA mA mA mA mA mA mA
Measuring Circuit
IOH1 Output Current 1 (P1.0 to P1.3) (P2.0 to P2.3) IOL1 IOH1S IOL1S Output Current 2 (BD) Output Current 3 (When S0 to S15 are configured as output ports) (P3.0 to P3.3) (P4.0 to P4.3) (P5.0 to P5.3) (P6.0 to P6.3) IOH2 IOL2 IOH3 IOL3 IOH3S IOL3S IOH4 IOMH4 Output Current 4 (S0 to S22) (COM0 to COM3) IOMH4S IOML4 IOML4S IOL4 Output Current 5 (OSC2) IOH5R IOL5R IOH5C IOL5C Output Leakage Current (P1.0 to P1.3) (P2.0 to P2.3) IOOH IOOL
2 mA mA mA mA mA mA mA mA mA mA mA mA VOMH4 = VSS1 + 0.2 V (VSS1 level) VOMH4S = VSS1 - 0.2 V (VSS1 level) VOML4 = VSS2 + 0.2 V (VSS2 level) VOML4S = VSS2 - 0.2 V (VSS2 level) VOL4 = VSS3 + 0.2 V (VSS3 level)
VOH5R = -0.5 V (RC oscillation mode) -6.0 VOL5R = VSS + 0.5 V (RC oscillation mode) VOH5C = -0.5 V 0.7
(ceramic oscillation mode) -100
VOL5C = VSS2 + 0.5 V (ceramic oscillation mode) VOH = VDD VOL = VSS
10 -- -0.3
18/29
Semiconductor DC Characteristics (continued)
MSM64172
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = VSS = -3.0 V, VSS3 = -4.5 V, Ta = -10 to +65C unless otherwise specified) Parameter (Pin Name)
Symbol
Condition VIH1 = VDD (when pulled down) VIL1 = VSS (when pulled up)
VIH1 = VDD, VSS = -5 V (when pulled down)
Min. 30 -300 80
Typ. 90 -90 250 -250 -- -- -110 -- -- 1.5 -1.5 -- -1.5 -- -- -- -- -- -- -- --
Max. 300 -30 800 -80 1.0 0 -30 1 0 3 -0.75 1.0 -0.75 0 -2.4 0 -4.0 0 -2.4 0 -2.4
Unit mA mA mA mA mA mA mA mA mA mA mA mA mA V V V V V V V V
Measuring Circuit
IIH1 Input Current 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) IIL1 IIH1S IIL1S IIH1Z IIL1Z IIL2 Input Current 2 (OSC1) IIH2Z IIL2Z IIH2C IIL2C Input Current 3 (RESET, TST1, TST2) Input Voltage 1 (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) IIH3 IIL3 VIH1 VIL1 VIH1S VIL1S Input Voltage 2 (OSC1) Input Voltage 3 (RESET, TST1, TST2) VIH2 VIL2 VIH3 VIL3
VIL1 = VSS = -5 V (when pulled up) -800 VIH1 = VDD (in a high impedance state) VIL1 = VSS (in a high impedance state) VIL2 = VSS2 (when pulled up) VIH2 = VDD (RC oscillation mode) VIL2 = VSS2 (RC oscillation mode) VIH2 = VDD (ceramic oscillation mode) VIL2 = VSS2 (ceramic oscillation mode) VIH3 = VDD VIL3 = VSS2 -- -- VSS = -5 V VSS = -5 V -- -- -- -- 0 -1.0 -300 0 -1 0.75 -3 0 -3.0 -0.6 -3.0 -1.0 -5.0 -0.6 -3.0 -0.6 -3.0
3
4
19/29
Semiconductor
MSM64172
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = -1.5 V, VSS2 = VSS = -3.0 V, VSS3 = -4.5 V, Ta = -10 to +65C unless otherwise specified) Parameter (Pin Name) Hysteresis Width (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3) Hysteresis Width (RESET, TST1, TST2) Input Pin Capacitance (P0.0 to P0.3) (P1.0 to P1.3) (P2.0 to P2.3)
Symbol
Condition
Min.
Typ.
Max.
Unit
Measuring Circuit
DVT1 DVT1S DVT2 VSS = -5 V
--
0.2 0.25
0.5 1.0
1.0 1.5
V V 4
--
0.2
0.5
1.0
V
CIN
--
--
--
5.0
pF
1
20/29
Semiconductor Measuring circuit 1
External Circuit (*) q OSC1 XT
MSM64172
w
OSC2 VSSL VDD VSS2 A
MSM64172 (3.0 V Spec.)
Crystal 32.768 kHz VDD CG Note: Connect a 15 pF capacitor if CG is external.
XT C1 C2 C12
VSS1
VSS3
VSS
Cl
Ca V
Cb V
* : Connect as follows. q ROS w In ceramic resonator oscillation mode VDD q CL1 Ceramic resonator w CL2
V
Ca, Cb, C12 Cl ROS CL1 CL2 Ceramic resonator
: : : : : :
0.1 mF 0.47 mF 100 kW 100 pF 100 pF CSB500E (500 kHz) (Murata MFG.-make)
Measuring circuit 2
(*2) VIH (*1) VIL A
INPUT
MSM64172 (3.0 V Spec.)
VDD
VSS1
VSS2
VSS3
VSSL
VSS
OUTPUT
21/29
Semiconductor Measuring circuit 3
(*3) A
MSM64172
MSM64172 (3.0 V Spec.)
VDD
VSS1
VSS2
VSS3
VSSL
VSS
Measuring circuit 4
OUTPUT VSS
OUTPUT
INPUT
VIH (*3) VIL
INPUT
MSM64172 (3.0 V Spec.)
Waveform Monitoring
VDD
VSS1
VSS2
VSS3
VSSL
*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.
22/29
Semiconductor AC Characteristics (Serial Interface)
MSM64172
(VDD = 0 V, VSS2 = -3 V, VSS = -5 V, Ta = -10 to +65C unless otherwise specified) Parameter SCLK Input Fall Time SCLK Input Rise Time SCLK Input "L" Level Pulse Width SCLK Input "H" Level Pulse Width SCLK Input Cycle Time SCLK Output Cycle Time SCLK Output Cycle Time SOUT Output Delay Time SIN Input Setup Time SIN Input Hold TIme Symbol tf tr tCWL tCWH tCYC Condition -- -- -- -- VSS = -5.25 V to -2.4 V Min. -- -- 0.8 0.8 1.8 -- -- -- 0.5 0.8 Typ. Max. -- -- -- -- -- 30.5 2.0 -- -- -- 1.0 1.0 -- -- -- -- -- 0.4 -- -- Unit ms ms ms ms ms ms ms ms ms ms
tCYC1(O) CPU operating at 32.768 kHz tCYC2(O) CPU operating at 500 kHz tDDR tDS tDH Cl = 10 pF -- --
AC characteristics timing ("H" level = 0.2 * VSS, "L" level = 0.8 * VSS)
tCYC SCLK (P2.2) tr tCWH tDDR SOUT (P2.0) tDDR 0V tf tCWL 0V
tDS SIN (P1.3)
tDH
tDS 0V
23/29
Semiconductor
MSM64172
FUNCTIONAL DESCRIPTION
CPU Peripheral Functions * Serial port (SIOP) The MSM64172 has an 8-bit synchronous serial port. Receive/transmit operation of the serial port is performed simultaneously and the serial transfer clock can select either internal or external mode. Direction of transfer data can be big endian or little endian. Each pin of the serial port is assigned as secondary functions of P1.3 and P2.0 to P2.2. Setting each bit of SIN, SOUT, SPR, and SCLK of P13CON and P20CON to P22CON to "1" makes each pin valid. * LCD driver (LCD) The MSM64172 has a built-in LCD driver for 27 outputs. The LCD driver consists of display registers (DSPR0-30), the Display Control Register (DSPCON), a 27-output LCD driver circuit, and a bias generation circuit (BIAS). There are three types of driving methods: 1/4 duty, 1/3 duty, and 1/2 duty. Software selects the duty mode. S0 to S15 of the LCD driver can be configured to be output ports by a mask option. The relationship between the duty, the bias method, and the maximum segment number follows: 1/4 duty 1/3 bias method ------- 92 segments (COM0-3, S0-22) 1/3 duty 1/3 bias method ------- 72 segments (COM0-2, S0-23) 1/2 duty 1/2 bias method ------- 50 segments (COM0, 1, S0-24) * Buzzer driver (BD) The MSM64172 has a built-in buzzer driver with 2 buzzer output frequencies and 4 buzzer output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer Frequency Control Register (BFCON). * Watchdog timer (WDT) The MSM64172 has a built-in watchdog timer to detect CPU malfunction. The watchdog timer is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog timer control register (WDTCON) to reset WDTC. * Clock generation circuit (2CLK) The Clock Generation Circuit (2CLK) consists of a 32.768 kHz crystal oscillation circuit, a highspeed clock generation circuit, and clock control logic. 2CLK generates the system clock (CLK) and the time-base clock (32.768 kHz). The high-speed clock generation circuit is available only for use in 3 V operation, and offers two modes, the RC Oscillation Mode and the Ceramic Resonator Oscillation Mode. The system clock is the source clock for the CPU. The time-base clock is the source clock for the TBC and BD. The system clock frequency is 32.768 kHz, which is output from the crystal oscillation circuit in 1.5 V operation. In 3.0 V operation, the system clock can be switched to 32.768 kHz, which is output from the crystal oscillation circuit, or to the frequency that is output from the high-speed clock oscillation circuit by controlling the contents of Frequency Control Register (FCON). The desired high-speed clock oscillation circuit mode also can be selected by using FCON.
24/29
Semiconductor
MSM64172
* Time base counter (TBC) The MSM64172 has a built-in time base counter (TBC) that generates clocks to be supplied to internal peripheral circuits. The time base counter is composed of 15 binary counters. The count clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, and the sampling clocks of each port. * I/O port Input-output ports (P1, P2) (8 bits)
Input port (P0) (4 bits)
: Pull-up (pull-down) resistor input or highimpedance input, CMOS output or NMOS open drain output: these can be specified for each bit; external 0 interrupt : Pull-up (pull-down) resistor input or highimpedance input; external 1 interrupt
* Interrupt (INTC) The MSM64172 has seven interrupt sources (seven vector addresses), of which two are external interrupts from ports and five are internal interrupts. Of the seven interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable interrupt). The other six interrupts are controlled by the master interrupt enable flag (MI) and the interrupt enable registers (IE0 and IE1). When an interrupt condition is met, the CPU branches to a vector address corresponding to the interrupt source.
25/29
Semiconductor
APPLICATION CIRCUITS
LCD
COM0
COM1
COM2/S24
COM3/S23
S22 to S0
OSC2 OSC1 32.768 kHz XT XT RESET
1.5 V Spec. Application Circuit
MSM64172-xxx (1.5 V Spec.)
P0.0 P0.1 P0.2 P0.3
VDD C2 C1 C12 VSS3 Cb VSS2 Ca VSS VSS1 VSSL TST2 TST1
C1 1.5 V
Cl * Without 5 V interface * CG of crystal oscillator : Internal
BD P2.3 P2.2 P2.1 P2.0 P1.3
Buzzer
MSM64172
26/29
Semiconductor
APPLICATION CIRCUITS (continued)
LCD
ROS
COM0
COM1
COM2/S24
COM3/S23
S22 to S0
OSC2 OSC1 XT XT RESET
32.768 kHz CGEX
MSM64172-xxx (3 V Spec.)
P0.0 P0.1 P0.2 P0.3
VDD C2 C1 C12 VSS3 Cb VSS2 VSS VSS1 VSSL TST2 TST1
3.0 V Spec. Application Circuit
C2 3V 5V
CS
Ca Cl * With 5 V interface * CGEX of crystal oscillator : External * High-speed RC oscillation mode selected (with external ROS)
BD P2.3 P2.2 P2.1 P2.0 P1.3
Buzzer High-speed clock monitor SCLK To serial communication interface SPR (5 V (VSS) ) SOUT SIN
MSM64172
27/29
Semiconductor
MSM64172
PACKAGE DIMENSIONS
(Unit : mm)
QFP56-P-910-0.65-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
28/29
Semiconductor
MSM64172
(Unit : mm)
QFP56-P-910-0.65-2K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
29/29

▲Up To Search▲

Price & Availability of MSM64172

	To Download MSM64172 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .